Engineering Photosensitive Resin
Engineering Photosensitive Resin
Technical Parameters
Technical Parameters
model W952
color White
Density (g/cm3 @ 25 ℃) 1.13(1.16)
Curing depth (mm) 0.145
Critical Exposure (mJ/cm2) 9.3
Construction layer thickness (mm) 0.1
Hardness (D) 83
Flexural modulus (MPa) 2,692-2,775
Bending strength (MPa) 69- 74
Tensile modulus (MPa) 2,189-2,395
Tensile strength (MPa) 27-31
elongation at break 12 -20%
Notched impact strength (J/m) 58 - 70
Heat distortion temperature (°C) 52
Glass transition temperature (°C) 62

Sample application
Sample application
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