Engineering Photosensitive ResinEngineering Photosensitive Resin
Engineering Photosensitive Resin
Strong and Sturdy
Dimensional stability, no deformation
Applicable robust parts requirements
Technical Parameters
Technical Parameters
model BT69
color Black
Density (g/cm3 @ 25 ℃) 1.11-~1.15
Curing depth (mm) 0.135~0.158
Critical Exposure (mJ/cm2) 8.3~9.2
Construction layer thickness (mm) 0.05~0.11
Hardness (D) 78~88
Flexural modulus (MPa) 2,722-2,792
Bending strength (MPa) 69~76
Tensile modulus (MPa) 2,649-2,731
Tensile strength (MPa) 41~58
elongation at break 7 -11%
Notched impact strength (J/m) 29~34
Heat distortion temperature (°C) 58~69
Glass transition temperature (°C) 62~75

Sample application
Sample application
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