High Tenacity Photosensitive Resin
High Tenacity Photosensitive Resin
Technical Parameter
Technical Parameter
model WL63
color White
Density (g/cm3 @ 25 ℃) 1.13(1.15)
Curing depth (mm) 0.149
Critical Exposure (mJ/cm2) 7.6
Construction layer thickness (mm) 0.1
Hardness (D) 88
Flexural modulus (MPa) 2,495-2,565
Bending strength (MPa) 71- 76
Tensile modulus (MPa) 2,511-2,665
Tensile strength (MPa) 40-58
elongation at break 11 -16%
Notched impact strength (J/m) 30-40
Heat distortion temperature (°C) 63
Glass transition temperature (°C) 75

Sample application
Sample application
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